Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for Nasa low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.
The adhesive cures at room temperature in 24-48 hours and in just 1-2 hours at 200°F, producing tough high-strength bonds. It features a tensile shear strength of more than 1,800psi, a T-peel of greater than 5pli, and outstanding adhesion to similar and dissimilar substrates.
The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275°F, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.
The epoxy offers a simple 1:1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a three-month shelf life and glass jars have a six-month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.
Master Bond electrically conductive adhesives
Master Bond’s polymer system EP21TDCS-LO was developed for high-performance bonding and sealing where superior electrical conductivity and Nasa low outgassing certification is required. Read more about Master Bond’s electrically conductive adhesives on our website or contact technical support by phone at +1 201 343 8983, by fax at +1 201 343 2132 or by email.